Microfabrication Engineer - Quantum Processor Engineering CDI 100%

At IDQuantique, we are building the world’s highest-performing quantum computers. Our full-stack technology, based around trapped-ion qubits, includes custom compilers, embedded firmware, mixed-signal and RF electronics, cryogenics, vacuum and lasers and is designed, manufactured and operated by our world leading scientists and engineers in the UK, the US and Switzerland.

We are now ready to extend our microfabrication team to include a full time process engineer who will work in the CMi cleanrooms and who will be based in or close to Lausanne, Switzerland.

This is a mainly hands-on, technical role and the successful candidate will be manufacturing the ion trap chips that form the heart of our quantum computers.

The ion trap chips consist of multiple, interconnected layers of patterned metal with oxide separation and include integrated, SiN photonic layers. They are fully manufacturable at the CMi cleanroom facility and, additionally, we have ongoing collaborations with external partners. There is scope for the successful candidate to be involved in maintaining and advancing these collaborations as well as identifying new partners and initiating suitable projects.

As well as producing functioning ion traps, process development is required to increase yield, meet more exacting tolerances, and investigate and implement new designs and functionalities.

You will be the only member of the microfab team that will be based full time in Switzerland, however, in-person contact and support will be available from the existing process engineers at least 30% of the time as well as online access to the whole company at any time. You will be an extremely important and valued member of an enthusiastic and highly motivated company.

What you’ll be responsible for:

You will be responsible for the end-to-end fabrication of ion trap chips, ensuring successful chip delivery through effective process flow design, execution of fabrication runs and accurate estimation of delivery timelines. You will maintain detailed wafer history runcards, track material and process data and contribute to process development by designing and executing experiments to enhance yield, improve tolerances and integrate new functionalities. Additionally, you will document findings through reports and play a key role in maintaining and advancing collaborations with external partners.

Responsibilities:
- Chip delivery
- Process flow design
-Planning & execution of fabrication runs
- Estimation of delivery times
- Production of full wafer history runcards
- Process development
- Experimental design
- Report writing
- Maintenance of material & process database

Requirements

• 3+ years experience with standard semiconductor processing
• 2D layout with e.g. Klayout software
• Laser and photolithography
• Thin film deposition
• Wet and dry etching
• Metrology: SEM, profilometry etc.
• Excellent communication skills
• Excellent organisational skills
• Ability to work independently

Thrives in environments with requirement uncertainty and constant influx of new information that impacts their projects

Desirable

Experience with ebeam lithography, particularly for photonic structures

You will need at least 3 years of experience in standard semiconductor processing, including 2D layout design (e.g., Klayout), laser and photolithography, thin film deposition, wet and dry etching, and metrology techniques such as SEM and profilometry. Strong communication and organisational skills are essential, as you will be expected to manage fabrication processes independently while coordinating with remote teams. You should be comfortable working in an environment where requirements evolve, requiring adaptability and problem-solving skills. Experience with e-beam lithography, particularly for photonic structures, would be a strong advantage.